The automotive power module serves as the heart of the Pin-Fin are optimized. It is suggested that the response surface methodology is an effective method to minimize the junction temperature and pressure drop of the power module with the Pin-Fin heatsink [5]. Recently, with the continuous improvement of the thermal management of the power module, the spray cooling and impinging jet cooling are proposed [6–8]. Although the heat dissipation performance is obviously better than that of the Pin-Fin-integrated baseplate, the control is complex, and the cost is high. These advanced thermal management with a large dissipation area of the power module still needs a long time to commercial production. Concerning the thermal channel optimization, the intelligent genetic algorithm is exploited to achieve the amazing heatsink with the 3D print process, which has the significant heat dissipation effect [9], [10]. However, the processing technology of this concept is complex, making it difficult to achieve industrial field. Regarding the thermal management of the automotive power module, the application of the Pin-Fin-integrated baseplate remains the most mature. Although some irregular Pin-Fin heatsink has significant advantages in reducing junction temperature and pressure drop, limited by processing technology and cost, the massive automotive power module still use the circular Pin-Fin heatsink. However, the elliptical Pin-Fin heatsink is a remarkable trend for the next-generation automotive power module. To confirm the advantages of the creative Pin-Fin concept, the thermo-fluid multi-physics assessment of the automotive power module with circular and elliptical Pin-Fins is highlighted. A test rig based on the front-to-front converter is set up to assess the thermal performance and pressure drop of compared Pin-Fin for the HybridPack Drive packaged power module. To ensure the validation of the experiments, the crosscheck finite element simulation model is established in the multi-physics tool COMSOL, considering the coupling principles of the electrical, thermal, and fluid fields. Finally, under the different dc-link voltage, phase current, and flow rate conditions, comprehensive experiments are demonstrated to assess the advantages and disadvantages of elliptical Pin-Fin in terms of thermal performance, pressure drop, and cost.