As an important development direction of power electronic systems, the integration technologies can bring many benefits, such as size reduction, reliability improvement, cost saving and so on. With the continuous development of power semiconductor devices, especially the emergence of wide band-gap devices, more advanced integration technologies are needed. This paper reviews the state-ofart integration technologies, including active and passive integration technologies. Active integration technology is reviewed in terms of the interconnect, packaging material, packaging structure, and module integration. Passive integration technology is reviewed from the aspects of magnetic integration technology, electromagnetic integration technology, and low-temperature cofired ceramic(LTCC) technology. Higher-level integration technologies, namely power supply on chip(PwrSoC) and power supply in package(PwrSiP), are also investigated, which are mainly used in low power applications.