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会员 Design of a Novel Double-Sided Cooling SiC Power Module Based on Multiple DBC-Stacked
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摘要
With the increasing power density and operating frequency of power electronic systems, the heat dissipation and electromagnetic performance of traditional packaged power modules cannot meet the requirements of the system. Silicon carbide (SiC) double-sided cooling power modules have the advantages of high reliability, high density, high power, and high efficiency, and have a wide application prospect in power electronic systems such as electric vehicle motor controllers. In this paper, a new type of double-sided cooling power module with laminated DBC structure is designed. The module can effectively reduce the stray inductance and improve the current carrying ability of the module. The design enables up to 12 SiC chips in parallel with a current capacity of 1000 A. The module finally passed electrical and thermal simulation evaluation and dual-pulse testing.
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