As electronic devices continue to miniaturize and integrate, thermal simulation has become a critical factor in their design. The traditional finite element method used for thermal simulation of electronic packaging modules faces a trade-off between computational time and accuracy, and also encounters difficulties in handling large deformation problems and grid distortion. We propose a thermal simulation system for electronic packaging modules based on the Smoothed Particle Hydrodynamics algorithm, effectively addressing the aforementioned challenges. The system resolves the heat conduction equation by discretizing the simulation object into a set of particles, thus accurately predicting and simulating the thermal behavior of the electronic packaging module.