Compact, light weight and efficient Power Electronic Building Blocks are seen as fundamental components of future More Electric Power Systems, e.g. More Electrical Aircraf t. Core el-ements supporting the trend are power modules employing solely SiC MOSFETs. In order to take advantage of the high switching speed enabled by SiC, novel modules concepts must be investigat-ed. For example, low inductance planar interconnection technolo-gies, integrated buffer capacitors and damping networks are pos-sible solutions to mitigate switching overvoltages and oscillations at the switching node occurring for conventional modules. In this paper, the analysis and the design of a novel ultra-low inductance 1200 V SiC power module featuring an integrated buffer-damping network are discussed. The power module is first described and characterized with impedance measurements. Afterwards, a gen-eral optimization procedure for the sizing and the selection of the integrated components is presented and measurements are per-formed to verify the analysis and to highlight the improvements of the proposed solution.