EFFICIENCY and power density have been widely prototype was designed to prove the accuracy of the proposed model and optimized heatsink. while the safety and reliability issues are attracting more and The paper by Y. Chen and his co-authors from Southeast University proposes a method to predict the parameter shift of planar transformers under thermal stress using a deep learning algorithm. The advantage and accuracy of the used Bi-LSTM algorithm have been verified in experiment. The paper by Y. Duan and his co-authors from Hebei University of Technology presents an online on-state voltage measurement circuit for SiC MOSFETs, which solves the problems of large errors, complex structure, and low reliability of traditional on-state drain-source voltage measurement circuits. The paper by J. Miao and his co-authors from Huazhong University of Science and Technology studies the influence of various sampling frequencies of output voltage on soft fault diagnosis accuracy of DC/DC converters, which provides a reference for the selection of signal sampling frequency for soft fault diagnosis of DC/DC converters in practical engineering applications. The paper by D. Nayak and his co-authors from Indian Institute of Technology Delhi presents a simulation-based electro-thermal junction temperature assessment method for the SiC MOSFETs in a half-bridge configuration based on the datasheet parameters. The method has been validated on a 10kW three-phase interleaved boost converter laboratory prototype. The paper by Z. Xu and his co-authors from Southwest Jiaotong University, China and Aalborg University, Denmark presents a fast calculation method for IGBT junction temperature based on Fourier transform. Its effectiveness is verified through extensive simulations and experimental tests. We appreciate the efforts of all authors who had submitted papers and we appreciate timely reviews from Guest Associate Editors and reviewers, especially at this time of difficulty. ▪ Dao Zhou, Aalborg University, Denmark ▪ Zhen Xin, Hebei University of Technology, China ▪ Shenghui Cui, Seoul National University, Korea ▪ Qian Wang, Wuhan University of Technology, China ▪ Qiao Peng, Sichuan University, China ▪ Li Wei, Tongji University, China ▪ Yingzhou Peng, Hunan University, China ▪ Zhiqing Yang, Hefei University of Technology, China